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PCB CAM

PCB CAM

Front End Engineering

PCB CAM

Lightup Electronics provides world-class, one-stop PCB CAM and Front-End Engineering solutions for PCB manufacturers, supporting single-sided, double-sided, and multilayer boards up to 42 layers. Our engineers bring over 15 years of individual experience, ensuring accuracy and production-ready outputs.

We are proficient in industry-leading software such as Ucamco UCAM, Genesis 2000, CAM350, and Speedstack Polar, enabling precise and efficient CAM processing.

Our team has extensive experience serving diverse sectors, including Automotive, Aerospace, Defense, Consumer Electronics, Telecom, Medical, Space, Marine, and Oil & Gas industries.

Compliance with IPC, MIL, Space, and customized industry standards

  • Extensive expertise in handling multiple PCB data formats
  • DFM Preparation: Detailed Gerber analysis with comprehensive manufacturability reports
  • Image Preparation: Single-sided, double-sided, and multilayer boards (up to 42 layers)
  • Build-up Recommendations & Impedance Calculations
  • Design Rule Check (DRC) and error correction as per manufacturing requirements
  • Standard and Custom Panel (Array) Creation

Specialized CAM Preparation & Processing

  • Support for Controlled Impedance Designs
  • Expertise in HDI, RF & Microwave PCBs
  • Blind & Buried Via Technology
  • Flex and Rigid-Flex PCB Solutions
  • Gold Finger, Hard Gold, and Edge Plating
  • Via Filling & Capping / Copper-Filled / Stacked Microvias
  • Edge Castellation & Stamp Hole Technology
  • Press-Fit Technology and Countersink (CSK)
  • Thermal Management (Heat Sink/Drain), Back Drilling, Depth Drilling & Advanced Features

Panel Image Preparation

  • Flip/Flop & Multi-Board Panel Arrangement
  • Drill, Rout & V-Scoring Outputs
  • Test Coupon Placement

Electrical Test Program Generation (ATG, EMMA, Probot, MNF1, MNF2, etc.)

AOI Output Generation

FAI (First Article Inspection) Reports

  • Dedicated, full-fledged CAM facility for Gerber data post-processing (pre-manufacturing)
  • 24/7 support to serve global customer requirements
  • Advanced software, hardware, and communication infrastructure
  • Support for single-layer to multilayer PCBs (up to 42 layers) as per IPC standards
  • Expertise in SMT, BGA, and through-hole designs with blind & buried vias
  • Handling of split ground and power planes for mixed-signal designs
  • High-speed design support with early analysis and optimization
  • Post-layout analysis including signal integrity and impedance matching
  • Netlist, reliability, and thermal analysis
  • Design editing and optimization
  • Rout & retain processing
  • Step-and-repeat panelization with break-away tabs
  • Support for slots, scoring, V-cuts, and routing
  • Teardrop implementation
  • Multiple circuit panelization
  • Test coupon creation

We perform a wide range of DFM (Design for Manufacturability) checks across multiple layers, including copper, solder mask, silkscreen, and drill layers, to ensure optimal productivity and manufacturability.

Key inputs and DFM considerations include:

  • Netlist file
  • Schematic (Adobe PDF preferred)
  • Board outline drawing
  • Bill of Materials (Excel format preferred)
  • Datasheets for components with more than two pins
  • Critical component locations (if applicable)
  • Trace width, spacing (clearance), via drill size, annular ring, etc.
  • Critical routing constraints (if applicable)
  • Expected number of layers (if known)
  • Layer Alignment
  • Draw-to-Flash Conversion
  • Pad Registration Optimization
  • NFP (Non-Functional Pad) Removal
  • Redundant Pad & Line Removal
  • Line Unification
  • Contour Correction of Self-Intersecting Polygons
  • Sliver Removal in Acute Angles
  • SMD Attribute Definition
  • Legend (Silkscreen) Detection
  • Netlist Comparison: IPC netlist vs. CAD data
  • Netlist Verification: Processed data vs. customer-provided data
  • Hole Analysis: Missing, extra, close, touching, or duplicate holes
  • Drill Optimization: Verification of secondary drill options
  • Spacing Checks: Minimum spacing between conductors and drill-to-conductor spacing
  • Track & Ring Validation: Minimum track width and annular ring requirements
  • Sliver Detection & Removal
  • Thermal Relief Checks: Air gap and spoke width validation
  • Drill-to-Plane Clearance Verification
  • Plane Shear Line Width Checks
  • Solder Mask Validation: Annular ring, trace exposure, and mask-to-copper spacing
  • Legend (Silkscreen) Width Verification

We perform an exhaustive set of Design Rule Checks (DRC) for all boards to prevent errors that could lead to board scrap. Every feature is thoroughly verified for violations before panelization.

Key Checks Include:

  • Mismatch between fabrication drawing and Gerber files
  • Separation between segments
  • Minimum track width verification
  • Detection of open or hanging traces
  • Power-to-ground short detection
  • Annular ring verification
  • Hole-to-copper segment spacing
  • Exposed trace checks
  • General spacing and clearance issues
  • Power and ground plane optimization
  • Signal layer refinement and routing optimization
  • Teardrop generation for enhanced reliability
  • Solder mask design optimization
  • Legend placement and overlap correction
  • Copper balancing for improved manufacturability
  • Etch compensation for accurate fabrication
  • Gold finger finishing and hard gold plating on base copper
  • Edge plating for enhanced durability and connectivity
  • Controlled impedance design for signal integrity
  • Via plugging, peelable mask, and carbon ink applications
  • Flip-flop panelization for efficient PCB manufacturing
  • Edge castellated holes and stamp technology
  • Flex and rigid-flex PCB solutions
  • Coverlay and stiffener integration programs
  • Step-and-repeat board layout on large panels
  • Venting pattern design for efficient processing
  • Tooling holes, registration targets, and punch targets setup
  • Impedance control coupons for testing and validation
  • Compensation for lamination shrinkage to ensure dimensional accuracy
  • NC drilling and routing program development
  • Routing programs for plated edges (post-drill, pre-etch)
  • Second-stage drilling program setup
  • Counterbore and countersink machining
  • Panelization with tab routing and breakout features (mouse bites)
  • Peck drilling (G85 cycle) for precision hole creation
  • Controlled-depth routing operations
  • V-scoring program setup
  • Optimized toolpath generation
  • Coverlay and stiffener program integration
  • Scripting: Custom script development to support customer-specific production requirements within the Genesis system
  • Hyper Tooling: Java-based program development for UCAM to automate repetitive tooling tasks and improve efficiency
  • Tooling Services: End-to-end support by experienced engineers, including data input processing, design cleanup, DRC/DFM analysis, board editing, and final output generation

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Let’s Build Something Great Together

Outsource your PCB CAM, PCB layout, and design requirements to a trusted partner in India. At Lightup Electronics, we combine expertise, efficiency, and transparency to deliver results you can depend on. Contact us today to start a long-term, value-driven partnership.

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